HUHUTECH Wins €13.9M EU Chip Plant Contract

HUHUTECH International Group Inc. announced that its German subsidiary has secured a contract valued at approximately €13.9 million (US$15.0 million) for High-Purity Process (HPS) system engineering projects. This contract is with a leading European pure-play semiconductor foundry and will support their new advanced-node wafer fab in Dresden. The orders were secured through a competitive tender process between October 2025 and May 2026. This marks HUHUTECH's first strategic benchmark orders in Europe and aligns with its "Global 2026" initiative, expanding its customer base across key international markets. The CEO, Yujun Xiao, highlighted that this contract validates the company's technical capabilities and delivery capacity in demanding markets. HUHU Germany will independently manage the project, delivering specialty gas supply infrastructure for various semiconductor processes. The products manufactured at the facility serve high-growth end markets, including smartphones, AI, automotive electronics, and consumer electronics. This engagement signifies HUHUTECH's strategic investment in its German subsidiary and strengthens its role as a critical infrastructure provider in the global semiconductor supply chain, potentially leading to follow-on orders and services.